Electrical connection device, method for producing the same, and structure of flexible wiring board

ABSTRACT

In an electrical connection device in which a adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.

TECHNICAL FIELD

The present invention relates to an electrical connection device and amethod for producing an electrical connection device, and furtherrelates to a wiring structure.

BACKGROUND ART

A film-type electrical connection device is well known, and FIG. 1illustrates a configuration of an electrical connection device describedin Japanese Registered Patent No. 4519011 as a prior art example of thefilm-type electrical connection device.

This electrical connection device 10 includes a base 11 made of a filmhaving flexibility and an insulation property, a medium layer 12 that isarranged on the base 11 and is made of a gluing agent or an adhesive,reinforcing films 13 and 13′ that are arranged in a pattern shape on themedium layer 12, and conductors 14 and 14′ that are arranged on thereinforcing films 13 and 13′ and are fixed on the reinforcing films 13and 13′.

When the electrical connection device 10 is pressed on a connectionobject, the medium layer 12 is bonded or adheres to the connectionobject to be mechanically fixed to the connection object and theconductors 14 and 14′ are pressed onto wiring (conductor part) of theconnection object by elastic force of the medium layer 12 to obtainelectrical connection.

The reinforcing films 13 and 13′ are provided to enhance durability ofthe conductors 14 and 14′, that is, the conductors 14 and 14′ are hardlybroken because the conductors 14 and 14′ are fixed on the reinforcingfilms 13 and 13′ which hardly stretch even when the medium layer 12deforms.

This electrical connection device 10 is manufactured in the processdescribed below.

(1) A metal thin film is formed on a film material 15 serving as areinforcing film by sputtering, the metal thin film is further thickenedby plating, an etching treatment is then applied to the metal thin filmso as to obtain a wiring pattern shape, and plating is further appliedto the wiring pattern, obtaining a wiring pattern 16 including theconductors 14 and 14′ illustrated in FIG. 2A.

(2) Subsequently, exposed portion of the film material 15, on which thewiring pattern 16 is not formed, is drilled with laser so as to formholes 17 illustrated in FIG. 2B.

(3) Then, the film material 15 which is drilled is fixed to the mediumlayer 12 which is arranged on the base 11 and unnecessary portion is cutout.

Thus, the electrical connection device 10 illustrated in FIG. 1 isobtained.

As described above, the electrical connection device 10 which is in theprior art film type is manufactured in a manner in which the wiringpattern 16 is formed through a film forming process such as sputteringand plating and an etching process, and a drilling process with laserand a cutting process are further performed. Thus, manufacturing of theelectrical connection device 10 of prior art is not simple and isaccordingly inferior in mass productivity and customizability conformingto a design.

BRIEF SUMMARY OF THE INVENTION

An object of the present invention is to provide a film type electricalconnection device which is easily manufactured, exhibiting excellentmass productivity and customizability and further exhibiting superiorbending resistance and reliability, a method for producing theelectrical connection device, and a wiring structure having theseadvantageous characteristics.

Effects of the Invention

According to the present invention, an elastomer pattern and a conductorpattern included in an electrical connection device are formed byprinting.

According to the present invention, the electrical connection device ismanufactured by printing and thus can be easily manufactured andexhibits excellent mass productivity and customizability, dissimilar toa prior art film-type electrical connection device which is manufacturedthrough steps of sputtering, plating, etching, and laser processing.

Further, stress exerted on the conductor pattern in bending is reducedby the elastomer pattern, being able to suppress a phenomenon in whichthe stress increases a resistance value of the conductor pattern andfurther causes breakage of the conductor pattern. Thus, an electricalconnection device exhibiting superior bending resistance and reliabilitycan be obtained.

Furthermore, according to the present invention, a structure of aflexible wiring board that is easily manufactured and exhibits excellentbending resistance can be realized.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a related art example of anelectrical connection device.

FIG. 2A is a diagram for explaining a method for manufacturing theelectrical connection device illustrated in FIG. 1.

FIG. 2B is a diagram for explaining the method for manufacturing theelectrical connection device illustrated in FIG. 1.

FIG. 3 is a perspective view illustrating an embodiment of an electricalconnection device according to the present invention.

FIG. 4 is a graph showing bending test results obtained when alongitudinal elastic modulus of an elastomer pattern was changed.

FIG. 5A is a process diagram for explaining a method for producing anelectrical connection device according to the present invention.

FIG. 5B is a process diagram for explaining a partially-changed exampleof the process shown in FIG. 5A.

FIG. 6A is a diagram illustrating a layer structure of a sample A usedin a bending test.

FIG. 6B is a diagram illustrating a layer structure of a sample B usedin the bending test.

FIG. 6C is a diagram illustrating a layer structure of a sample C usedin the bending test.

FIG. 6D is a diagram illustrating a layer structure of a sample D usedin the bending test.

FIG. 7 is a graph showing bending test results of respective samplesillustrated in FIGS. 6A to 6D.

FIG. 8A is a diagram illustrating a first layer structure used for anembodiment of a wiring structure according to the present invention.

FIG. 8B is a diagram illustrating a second layer structure used for theembodiment of the wiring structure according to the present invention.

FIG. 9 is a diagram illustrating the embodiment of the wiring structureaccording to the present invention.

FIG. 10A is a diagram illustrating a first layer structure used foranother embodiment of a wiring structure according to the presentinvention.

FIG. 10B is a diagram illustrating a second layer structure used for theother embodiment of the wiring structure according to the presentinvention.

FIG. 11 is a diagram illustrating the other embodiment of the wiringstructure according to the present invention.

LIST OF REFERENCE NUMERALS

-   10: electrical connection device-   11: base-   12: medium layer-   13, 13′: reinforcing film-   14, 14′: conductor-   15: film material-   16: wiring pattern-   17: hole-   20: electrical connection device-   21: base-   22: adhesive layer-   23: elastomer pattern-   23′: ink pattern-   24: conductor pattern-   24′: ink pattern-   25: elastomer layer-   26: adhesive layer-   27: base-   28: blanket-   30: first layer structure-   31: base-   32: first adhesive layer-   33: elastomer pattern-   34: conductor pattern-   40: second layer structure-   41: base-   42: second adhesive layer-   43: elastomer layer-   50: wiring structure-   60: first layer structure-   61: base-   62: first adhesive layer-   63: first elastomer pattern-   64: first conductor pattern-   70: second layer structure-   71: base-   72: second adhesive layer-   73: second elastomer pattern-   74: second conductor pattern-   80: wiring structure-   81: wiring part

DETAILED DESCRIPTION

FIG. 3 illustrates a configuration of an embodiment of an electricalconnection device according to the present invention. In this example,an electrical connection device 20 includes a base 21, an adhesive layer22 which is disposed on the entire surface of the base 21, a pluralityof lines of elastomer patterns 23 which are arrayed and formed on theadhesive layer 22, and conductor patterns 24 which are respectivelyformed on the elastomer patterns 23.

The elastomer patterns 23 and the conductor patterns 24 are configuredto mutually have the same width and length and have an identical patternshape in this example, and an array pitch and the number of lines of theelastomer patterns 23 and the conductor patterns 24 are determineddepending on wiring of a connection object such as a wiring substrate tobe connected.

In the above-mentioned configuration, the base 21 is a film base havingflexibility. Examples of a material of the film base may includepolyethylene terephthalate (PET), polyethylene naphthalate (PEN), andpolyimide (PI).

The adhesive layer 22 elastically deforms in response to pressing and isbonded to a connection object, thus bearing mechanical coupling with theconnection object. Also, the elastic restoring force of the adhesivelayer 22 serves as a load in a direction pressing the conductor patterns24 on wiring of the connection object. An adhesive constituting theadhesive layer 22 essentially contains a pressure sensitive adhesive(that is, a gluing agent) and may contain other types of adhesives suchas a thermosetting type adhesive and a UV irradiation curable typeadhesive. Examples of the adhesive include polyester based-,polyurethane based-, acrylic based-, epoxy based-, phenolic based-,silicone based-, polyolefin based-, polyimide based-, vinyl based-, andnatural polymer based-polymers. The above-cited polymers may besingularly used or may be used in a combined manner.

Further, in order to enhance an adhesivity and a mechanical property,polyester based-, polyurethane based-, acrylic based-, epoxy based-,phenolic based-, silicone based-, polyolefin based-, polyimide based-,vinyl based-monomers or oligomers, for example, may be mixed with theabove-cited polymers and used.

The elastomer patterns 23 are provided so as to reduce stress exerted onthe conductor patterns 24 when the electrical connection device 20 isbent, for example. Both of the elastomer patterns 23 and the conductorpatterns 24 are formed by printing in this example.

Printing for the conductor patterns 24 is performed by using an inkcontaining conductive particles such as gold particles, silverparticles, and copper particles and the conductor patterns 24 are formedby heat-curing the ink.

The elastomer patterns 23 reduce stress exerted on the conductorpatterns 24 when the electrical connection device 20 is bent asdescribed above, in other words, the elastomer patterns 23 function insuch a way that even when the adhesive layer 22 expands and contracts inresponse to bending of the base 21, the conductor patterns 24 are lesssusceptible to an influence of the expansion and contraction of theadhesive layer 22. Accordingly, a longitudinal elastic modulus E₂ of theelastomer patterns 23 interposed between the adhesive layer 22 and theconductor patterns 24 is set to be larger than a longitudinal elasticmodulus E₁ of the adhesive layer 22. A longitudinal elastic modulus isalso called Young's modulus.

Printing for the elastomer patterns 23 is performed by using an inkcontaining an elastomer composition constituting elastomer, and theelastomer patterns 23 containing elastomer is formed by heat-curing theink. Examples of the elastomer to be employed include silicone rubber,urethane rubber, fluoro-rubber, nitrile rubber, acrylic rubber, styrenerubber, chloroprene rubber, and ethylene-propylene rubber.

The longitudinal elastic modulus E₂ of the elastomer pattern 23 is setto be larger than the longitudinal elastic modulus E₁ of the adhesivelayer 22 (though depending on a material, the longitudinal elasticmodulus E₁ is commonly 0.01 to 1 MPa). Here, results of a bending testthat were obtained by using samples, the elastomer patterns 23 of whichmutually have different longitudinal elastic moduli E₂, will bedescribed.

Five kinds of samples whose longitudinal elastic moduli E₂ were 1 MPa,10 MPa, 100 MPa, 1000 MPa, and 1500 MPa were prepared under thecondition that the samples have the same layer structure as that of theelectrical connection device 20 illustrated in FIG. 3. The longitudinalelastic modulus E₁ of the adhesive layer 22 of every sample was set tobe 0.1 MPa. The conductor patterns 24 were formed with an ink containingsilver particles. Regarding the layer thickness of each layer, the base21 is 0.025 mm thick, the adhesive layer 22 is 0.050 mm thick, theelastomer pattern 23 is 0.010 mm thick, and the conductor pattern 24 is0.010 mm thick.

In the bending test, the samples were repeatedly bent (curved) by 180°in a manner in which the conductor patterns 24 were folded to be seenoutside, and change in a resistance value of the conductor patterns 24corresponding to the number of times of bending was examined. The bentportion was set to have an arc shape of 3 mm radius (half of an externaldiameter).

A graph in FIG. 4 illustrates results of the bending test, and change(increase) in a resistance value of the conductor patterns 24 caused bybending is shown as a change rate.

FIG. 4 shows that change in a resistance value is larger as thelongitudinal elastic modulus E₂ of the elastomer pattern 23 is larger.If a criteria that a resistance value change rate in 1000 times of 180°bending is equal to or smaller than 20% is set, for example, it can besaid that the longitudinal elastic modulus E₂ of 1500 MPa of theelastomer pattern 23 does not satisfy the criteria and the longitudinalelastic modulus E₂ which is set to be equal to or smaller than 1000 MPais preferable. This is because an excessively large longitudinal elasticmodulus E₂ causes an occurrence and advance of breakage of the elastomerpattern 23 itself along with increase in the number of times of bendingand the breakage of the elastomer pattern 23 induces an occurrence andadvance of breakage of the conductor pattern 24, deteriorating anelectro-conductive property. Here, FIG. 4 shows that the resistancevalue change of the sample whose longitudinal elastic modulus E₂ is 1MPa is the smallest and accordingly, advantageous effects of stressreduction can be sufficiently obtained when the longitudinal elasticmodulus E₂ is set to be approximately 10 times larger than thelongitudinal elastic modulus E₁ of the adhesive layer 22.

A method for producing the above-described electrical connection device20 will now be described in a step order with reference to FIG. 5A.

Both of the elastomer patterns 23 and the conductor patterns 24 areformed by offset printing. Here, a plate used in the following steps 1and 1′ and steps 2 and 2′ may be a screen plate, a gravure plate, oranother printing plate. In other words, printing performed in thesesteps may be screen printing, gravure printing, or another kind ofprinting.

<Step 1>

Ink patterns containing conductive particles are printed from a plate toa blanket 28 and are heat-cured to form the conductor patterns 24.

<Step 2>

Ink patterns containing an elastomer composition are printed from aplate to the conductor patterns 24 on the blanket 28 in a manner to lieover the conductor patterns 24 and the patterns are heat-cured to formthe elastomer patterns 23.

<Step 3-1> to <Step 3-3>

The conductor patterns 24 and the elastomer patterns 23 are transferredfrom the blanket 28 onto the adhesive layer 22 disposed on the base 21having flexibility so that the elastomer patterns 23 are positionedimmediately on the adhesive layer 22.

Through the above-described steps, the electrical connection device 20is completed.

Here, the above-described steps 1 and 2 may be changed to steps 1′, 2′,and 2″ described below depending on a kind of an ink to be used, acuring condition, and the like (see FIG. 5B).

<Step 1′>

Ink patterns 24′ containing conductive particles are printed from aplate to the blanket 28.

<Step 2′>

Ink patterns 23′ containing an elastomer composition are printed from aplate onto the ink patterns 24′ containing conductive particles on theblanket 28 in a manner to lie over the ink patterns 24′.

<Step 2″>

The ink patterns 24′ containing conductive particles and the inkpatterns 23′ containing an elastomer composition are simultaneouslyheat-cured, forming the conductor patterns 24 and the elastomer patterns23.

The electrical connection device and the method for producing theelectrical connection device according to the present embodiment havebeen described thus far. According to this embodiment, both of theconductor patterns 24 and the elastomer patterns 23 are formed byprinting and thus, the manufacturing is easy and exhibits excellent massproductivity and customizability.

Further, stress exerted on the conductor patterns 24 when the electricalconnection device 20 is bent is reduced by the elastomer patterns 23interposed between the adhesive layer 22 and the conductor patterns 24,being able to suppress an occurrence of a phenomenon of increase in aresistance value of the conductor patterns 24 and resulting completebreakage of the conductor patterns 24. Thus, the conductor patterns 24exhibit superior bending resistance and reliability.

As described above, stress exerted on the conductor patterns 24 inbending can be reduced and bending resistance of the conductor patterns24 can be improved by disposing an elastic body (the elastomer patterns23) whose longitudinal elastic modulus E₂ is larger than thelongitudinal elastic modulus E₁ of the adhesive layer 22. The followingdescription is about results of a bending test obtained by examiningwhether or not the bending resistance further improves when employing alayer structure in which the conductor patterns 24 are interposedbetween elastic bodies.

FIGS. 6A to 6D illustrate layer structures of samples A to D used in thebending test and FIGS. 6A to 6D give the same reference numerals toportions corresponding to respective portions in the layer structure ofthe electrical connection device 20 illustrated in FIG. 3.

The sample A is obtained by eliminating the elastomer patterns 23 fromthe layer structure of FIG. 3 and is provided as a comparison. Thesample B has the layer structure of FIG. 3. The sample C is obtained ina manner in which an elastomer layer 25, which is formed with an inkthat is the same as the ink used for print-forming the elastomerpatterns 23, is disposed on the conductor patterns 24 of the layerstructure of FIG. 3 to extend over the entire surface of the sample andthe elastomer layer 25 is bonded to the adhesive layer 22 by pressing.

The sample D has a layer structure in which an adhesive layer 26, whichis made of the same adhesive as the adhesive layer 22, and a base 27 aredisposed on the elastomer layer 25 of the sample C. The sample D isobtained by disposing the base 27 with the adhesive layer 26 and theelastomer layer 25 formed thereon onto the sample B in a state in whichthe elastomer layer 25 faces below and pressing them. Here, longitudinalelastic moduli of the elastomer patterns 23 and the elastomer layer 25of all samples were set to be 500 MPa.

Regarding the layer thickness of each layer, the base 21 is 0.025 mmthick, the adhesive layer 22 is 0.050 mm thick, the elastomer pattern 23is 0.010 mm thick, the conductor pattern 24 is 0.010 mm thick, theelastomer layer 25 is 0.010 mm thick, the adhesive layer 26 is 0.050 mmthick, and the base 27 is 0.025 mm thick.

The bending test was performed in the same manner as the above-describedbending test. A graph of FIG. 7 shows the results of the bending test.This graph shows that the bending resistance of the sample C in whichthe conductor patterns 24 are interposed between elastic bodies improvedmore than that of the sample B and the bending resistance of the sampleD improved further than that of the sample C. It is considered that thisis because the conductor patterns 24 are positioned at the center of thecross section in the sample D, so that compressive stress or tensilestress is basically rarely exerted on the conductor patterns 24 even ifthe sample D is bent.

A structure of a flexible wiring board according to the presentembodiment will now be described with reference to FIGS. 8A, 8B, and 9.

FIG. 9 illustrates an embodiment of a wiring structure according to thepresent invention, and FIGS. 8A and 8B respectively illustrate a firstlayer structure and a second layer structure constituting the wiringstructure illustrated in FIG. 9.

As illustrated in FIG. 8A, a first layer structure 30 is structured in amanner in which a first adhesive layer 32 is disposed on a firstflexible base 31, elastomer patterns 33 obtained by curing an inkcontaining an elastomer composition are formed on the first adhesivelayer 32, and conductor patterns 34 obtained by curing an ink containingconductive particles are formed on the elastomer patterns 33.

As illustrated in FIG. 8B, a second layer structure 40 is structured ina manner in which a second adhesive layer 42 is disposed on a secondflexible base 41 and an elastomer layer 43 obtained by curing an inkcontaining an elastomer composition is disposed on the second adhesivelayer 42.

The first layer structure 30 and the second layer structure 40 aresuperposed to each other so that a surface on which the conductorpatterns 34 are formed and a surface on which the elastomer layer 43 isdisposed face each other. The first layer structure 30 and the secondlayer structure 40 are mechanically coupled and integrated with eachother by bonding a surface, on which the elastomer patterns 33 and theconductor patterns 34 are not formed, of the first adhesive layer 32 anda surface of the elastomer layer 43 to each other. Thus, a wiringstructure 50 illustrated in FIG. 9 is structured.

Here, the wiring structure 50 may be manufactured by a method in whichthe first layer structure 30 and the second layer structure 40 areindependently manufactured and then bonded to each other or, forexample, a method in which the elastomer patterns 33, the conductorpatterns 34, and the elastomer layer 43 are transferred onto the firstadhesive layer 32 which is disposed on the base 31 and the base 31having the obtained structure is bonded with the base 41 on which thesecond adhesive layer 42 is disposed.

The wiring structure 50 has the layer structure of the sample D used inthe above-described bending test and accordingly, exhibits excellentbending resistance. Here, the first adhesive layer 32 and the secondadhesive layer 42 are made of the same adhesive, and the longitudinalelastic moduli of the elastomer patterns 33 and the elastomer layer 43are set to be larger than the longitudinal elastic moduli of the firstand second adhesive layers 32 and 42.

Another embodiment of a wiring structure for a flexible wiring boardaccording to the present invention will now be described with referenceto FIGS. 10A, 10B, and 11.

FIGS. 10A and 10B respectively illustrate a first layer structure and asecond layer structure, and the first layer structure and the secondlayer structure constitute a wiring structure illustrated in FIG. 11.

As illustrated in FIG. 10A, a first layer structure 60 is structured ina manner in which a first adhesive layer 62 is disposed on a firstflexible base 61, first elastomer patterns 63 obtained by curing an inkcontaining an elastomer composition are formed on the first adhesivelayer 62, and first conductor patterns 64 obtained by curing an inkcontaining conductive particles are formed on the first elastomerpatterns 63.

As illustrated in FIG. 10B, a second layer structure 70 is structured ina manner in which a second adhesive layer 72 is disposed on a secondflexible base 71, second elastomer patterns 73 obtained by curing an inkcontaining an elastomer composition are formed on the second adhesivelayer 72, and second conductor patterns 74 obtained by curing an inkcontaining conductive particles are formed on the second elastomerpatterns 73.

The first layer structure 60 has the same structure as that of theabove-described first layer structure 30 illustrated in FIG. 8A and thesecond layer structure 70 has the same structure as that of the firstlayer structure 60 in this example.

The first layer structure 60 and the second layer structure 70 aresuperposed to each other so that a surface on which the first conductorpatterns 64 are formed and a surface on which the second conductorpatterns 74 are formed face each other. Accordingly, the first conductorpatterns 64 and the second conductor patterns 74 are superposed to eachother and come into direct contact with each other, structuring wiringparts 81.

The first layer structure 60 and the second layer structure 70 aremechanically coupled and integrated with each other by bonding a surfaceof the first adhesive layer 62, on which the first elastomer patterns 63and the first conductor patterns 64 are not formed, and a surface of thesecond adhesive layer 72, on which the second elastomer patterns 73 andthe second conductor patterns 74 are not formed, to each other. Thus, awiring structure 80 illustrated in FIG. 11 is structured.

Here, the wiring structure 80 may be manufactured by a method in whichthe first layer structure 60 and the second layer structure 70 areindependently manufactured and then bonded to each other or, forexample, a method in which the first elastomer patterns 63, the firstconductor patterns 64, the second conductor patterns 74, and the secondelastomer patterns 73 are transferred onto the first adhesive layer 62which is disposed on the base 61 and the base 61 having the obtainedstructure is bonded with the base 71 on which the second adhesive layer72 is disposed.

The first adhesive layer 62 and the second adhesive layer 72 elasticallydeform in response to pressing to be bonded to each other and theelastic restoring force thereof serves as a load in a direction in whichthe first conductor patterns 64 and the second conductor patterns 74 arepressed against each other, being able to obtain a favorable pressingstate, that is, a favorable electrically-coupling state between thefirst conductor patterns 64 and the second conductor patterns 74.Accordingly, the wiring part 81 with low resistance can be structured.Here, the longitudinal elastic moduli of the first and second elastomerpatterns 63 and 73 are set to be larger than the longitudinal elasticmoduli of the first and second adhesive layers 62 and 72.

A cross section of the wiring structure 80 has a vertically-symmetricstructure as illustrated in FIG. 11 and the wiring parts 81 arepositioned at the center of the cross section, so that resistance of thewiring parts 81 are lowered and the wiring structure 80 also exhibitsexcellent bending resistance in this example similarly to the wiringstructure 50 illustrated in FIG. 9.

The embodiments have been described thus far, but conductor patterns maybe print-formed with conductive stretchable paste, for example. In thiscase, since stretchable conductor patterns still have a limit inresistance to bending, provision of elastomer patterns effectivelyenhances the wiring's bending resistance. Further, when conductorpatterns are not formed with the above-mentioned conductive stretchablepaste and elastomer patterns have an identical pattern shape to that ofthe conductor patterns, the elastomer patterns may be set to haveconductivity, that is, may be print-formed with the conductivestretchable paste so as to obtain stronger bending resistance and lowerwiring resistance compared to the structure without the elastomerpatterns.

The foregoing description of the embodiments of the invention has beenpresented for the purpose of illustration and description. It is notintended to be exhaustive and to limit the invention to the precise formdisclosed. Modifications or variations are possible in light of theabove teaching. The embodiment was chosen and described to provide thebest illustration of the principles of the invention and its practicalapplication, and to enable one of ordinary skill in the art to utilizethe invention in various embodiments and with various modifications asare suited to the particular use contemplated. All such modificationsand variations are within the scope of the invention as determined bythe appended claims when interpreted in accordance with the breadth towhich they are fairly, legally, and equitably entitled.

What is claimed is:
 1. An electrical connection device comprising: aflexible base; an adhesive layer on the flexible base, the adhesivelayer containing a pressure sensitive adhesive; an elastomer pattern onthe adhesive layer, the elastomer pattern being formed of a cured inkcontaining an elastomer composition; and a conductor pattern on theelastomer pattern, the conductor pattern being formed of a cured inkcontaining conductive particles, wherein a longitudinal elastic modulusof the elastomer pattern is larger than a longitudinal elastic modulusof the adhesive layer.
 2. The electrical connection device according toclaim 1, wherein the elastomer pattern and the conductor pattern have anidentical pattern shape.
 3. The electrical connection device accordingto claim 1, wherein the longitudinal elastic modulus of the elastomerpattern is not greater than 1000 MPa.